NCV86604BD33R2G データシートの表示（PDF） - ON Semiconductor
部品番号
コンポーネント説明
一致するリスト
NCV86604BD33R2G Datasheet PDF : 14 Pages
| |||
NCV8660B
110
2.0 180
100
1.8 170
1.6 160
90
Power curve with PCB 1 oz cu
1.4 150
80
1.2 140
Theta JA curve
1.0 130
70
0.8 120
60
0.6 110
0.4 100
50
0.2 90
40
0
80
0
100 200 300 400 500 600 700
0
COPPER HEAT SPREADER AREA (mm2)
Figure 26. RqJA vs. PCB Copper Area (DPAK)
100
0.5
0.2
10 0.1
0.05
0.02
1
0.01
0.1 Single Pulse
1.3
Power curve with PCB 1 oz cu
1.2
1.1
1.0
0.9
Theta JA curve
0.8
100 200 300 400 500 600
COPPER HEAT SPREADER AREA (mm2)
Figure 28. RqJA vs. PCB Copper Area
(SOIC−8 Fused)
0.7
700
0.01
0.001
0.000001 0.00001
0.0001
Psi Tab−A
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 27. Transient Thermal Response (DPAK)
Cu Area = 645 mm2
100
1000
100 0.5
0.2
10
0.1
0.05
0.02
1 0.01
Single Pulse
0.1
0.01
0.001
0.000001 0.00001
Psi L−A
0.0001
0.001
0.01
0.1
PULSE TIME (sec)
1
10
Figure 29. Transient Thermal Response (SOIC−8 Fused)
Cu Area = 645 mm2
100
1000
www.onsemi.com
11
Share Link: 