NCV8842 データシートの表示（PDF） - ON Semiconductor
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NCV8842 Datasheet PDF : 16 Pages
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NCV8842
PACKAGE DIMENSIONS
SOIC 16−LEAD WIDE BODY EXPOSED PAD
PW SUFFIX
CASE 751AG−01
ISSUE A
−U−
A
M
16
P
0.25 (0.010) M W M 1
9
B
8
−W−
PIN 1 I.D.
G 14 PL
TOP SIDE
R x 45_
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
0.10 (0.004) T
D 16 PL
0.25 (0.010) M
C
−T−
K SEATING
PLANE
T U S WS
H
1
EXPOSED PAD
16
8
L
9
BACK SIDE
F
J
DETAIL E
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G
1.27 BSC
0.050 BSC
H 3.45 3.66 0.136 0.144
J 0.25 0.32 0.010 0.012
K 0.00 0.10 0.000 0.004
L 4.72 4.93 0.186 0.194
M 0_ 7 _ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
SOLDERING FOOTPRINT*
0.175
0.050
0.350
Exposed
Pad
0.200
0.074
CL
0.188
CL
0.376
0.024
0.150
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
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