NCV4269 データシートの表示（PDF） - ON Semiconductor

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NCV4269

5.0 V Micropower 150 mA LDO Linear Regulator with DELAY, Adjustable RESET, and Sense Output

ON Semiconductor 

NCV4269

MAXIMUM RATINGS (TJ = −40°C to 150°C)

Parameter

Symbol

Min

Max

Unit

Input to Regulator

Input Transient to Regulator

Sense Input

Reset Threshold Adjust

Reset Delay

Ground

Reset Output

Sense Output

Regulated Output

Junction Temperature

Storage Temperature

Input Voltage Operating Range

Junction Temperature Operating Range

Lead Temperature Soldering and MSL

VI

−40

45

V

II

Internally Limited Internally Limited

VI

−

60

V

VSI

−40

ISI

−1

45

V

1

mA

VRADJ

IRADJ

−0.3

−10

7

V

10

mA

VD

−0.3

7

V

ID Internally Limited Internally Limited

Iq

50

−

mA

VRO

−0.3

7

V

IRO Internally Limited Internally Limited

VSO

−0.3

7

V

ISO Internally Limited Internally Limited

VQ

−0.5

IQ

−10

7.0

V

−

mA

TJ

−

TSTG

−50

150

°C

150

°C

VI

−

TJ

−40

45

V

150

°C

Parameter

Symbol

Value

MSL, 20−Lead LS Temperature 265°C Peak (Note 3)

MSL

3

MSL, 20−Lead, LS Temperature 240°C Peak (Note 4)

MSL

1

MSL, 8−Lead, 14−Lead, LS Temperature 265°C Peak (Note 3)

MSL

1

MSL, 8−Lead EP, LS Temperature 260°C

MSL

2

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series incorporates ESD protection and exceeds the following ratings:

Human Body Model (HBM) ≤ 2.0 kV per JEDEC standard: JESD22–A114.

Machine Model (MM) ≤ 200 V per JEDEC standard: JESD22–A115.

2. Latchup Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78.

3. +5°C/−0°C, 40 Sec Max−at−Peak, 60 − 150 Sec above 217°C.

4. +5°C/−0°C, 30 Sec Max−at−Peak, 60 − 150 Sec above 183°C.

THERMAL CHARACTERISTICS

Characteristic

Test Conditions (Typical Values)

Unit

SO−8 Package (Note 5)

Junction−to−Pin 4 ( Y − JL4, YL4)

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

SO−8 EP Package (Note 5)

Junction−to−Pin 8 ( Y − JL8, YL8)

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

Junction−to−Pad ( Y − JPad)

SO−14 Package (Note 5)

Junction−to−Pin 4 ( Y − JL4, YL4)

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

SO−20 Package (Note 5)

Junction−to−Pin 4 ( Y − JL4, YL4)

Junction−to−Ambient Thermal Resistance (RqJA, qJA)

5. 2 oz copper, 50 mm2 copper area, 1.5 mm thick FR4

53.8

170.9

23.7

71.4

7.7

18.4

111.6

21.8

95.3

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

°C/W

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