NCP5680
MAXIMUM RATINGS (Note 3)
Symbol
Rating
Value
Unit
VBAT
Vout
Power Supply
Output Power Supply
−0.3 < Vbat < 7.0
V
6.0
V
SCL, SDA,
TRIGFL
Digital Input Voltage
Digital Input Current
−0.3 < V < VBAT
V
1
mA
ESD
Machine Model (Note 4)
200
V
PD
UQFN24 package − Power Dissipation @ TA = +85°C (Note 5)
Rqjc
UQFN24 package − Thermal Resistance Junction to Case
Rqja
UQFN24 package − Thermal Resistance Junction to Air
40
mW
11
°C/W
160
°C/W
TA
Operating Ambient Temperature Range
−40 to +85
°C
TJ
Operating Junction Temperature Range
−40 to +125
°C
TJmax
Maximum Junction Temperature
+150
°C
Tstg
Storage Temperature Range
−65 to + 150
°C
Latch−up current maximum rating per JEDEC standard: JESD78.
±100
mA
3. Maximum electrical ratings define the values beyond which permanent damage(s) may occur internally to the chip whatever be the operating
temperature
4. This device series contains ESD protection and exceeds the following tests:
Standard ESD protections must be used when handling any integrated circuit.
Appropriate ESD techniques must be observed to avoid damage to the device
Machine Model (MM) ±200V per JEDEC standard: JESD22−A115
5. The maximum package power dissipation limit must not be exceeded.
6. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
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