NCP372 データシートの表示（PDF） - ON Semiconductor

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NCP372

Positive and Negative Overvoltage Protection Controller with Internal Low Ron NMOS FETs and Status FLAG

ON Semiconductor 

NCP372

PIN FUNCTION DESCRIPTION

Pin Name Type

Description

1, 2

IN

POWER Input voltage pins. These pins are connected to the power supply. A 1 mF low ESR ceramic capacitor, or

larger, must be connected between these pins and GND. The two IN pins must be hardwired to common

supply.

3

GND POWER Main Ground

4

RES INPUT Reserved pin. This pin must be connected to GND.

5

RES INPUT Reserved pin. This pin must be connected to GND.

6

RES INPUT Reserved pin. This pin must be connected to GND.

7

GND POWER This pin must be directly hardwired to GND or through a pull down resistor with a 1 MW maximum value.

8

NC

NC

Not Connected

9

EN

INPUT Enable Pin. The device enters into shutdown mode when this pin is tied to a high level. In this case the

output is disconnected from the input. To allow normal functionality, the EN pin shall be connected to GND

to a pull−down or to an I/O pin. This pin does not have an impact on the fault detection.

10 FLAG OUTPUT Fault Indication Pin. This pin allows an external system to detect fault condition. The pin goes low when

input voltage exceeds OVLO threshold, drops below UVLO threshold, or internal temperature exceeds

thermal shutdown limit. Since the pin is open drain functionality, an external pull up resistor to VBat must

be added (10 kW minimum value).

11,12

OUT

OUTPUT

Output Voltage Pin. This pin follows IN pins when “no input fault” is detected. The output is disconnected

from the VIN power supply when the input voltage is under the UVLO threshold or above OVLO threshold

or thermal shutdown limit is exceeded.

13 PAD1 POWER The PAD1 is used to dissipate the internal MOSFET thermal energy and must be soldered to an isolated

PCB area. The area must not be connected to any potential other than a completely isolated one. See

PCB Recommendations on page 10.

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Minimum Voltage (IN to GND)

Minimum Voltage (All others to GND)

Vminin

Vmin

−30

V

−0.3

V

Maximum Voltage (IN to GND)

Maximum Voltage (OUT to GND)

Maximum Voltage (All others to GND)

Vmaxin

30

V

Vmaxout

10

V

Vmax

7

V

Maximum DC Current

Imax

2.5

A

Thermal Resistance, Junction−to−Air, (Note 1)

Operating Ambient Temperature Range

Storage Temperature Range

Junction Operating Temperature

ESD Withstand Voltage (IEC 61000−4−2)

Human Body Model (HBM), Model = 2, (Note 2)

Machine Model (MM) Model = B, (Note 3)

RqJA

TA

TSTG

TJ

Vesd

200

−40 to +85

−65 to +150

150

15kV air, 8kV contact

2000V

200V

°C/W

°C

°C

°C

kV

V

V

Moisture Sensitivity

MSL

Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The RqJA is highly dependent on the PCB heat sink area (connected to PAD1). See PCB recommendation paragraph.

2. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114.

3. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.

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