NCP334, NCP335
Figure 14. Routing Example 2 oz, 4 Layers, 605C/W
Example of application definition.
TJ * TA + RqJA Pd + RqJA RDS(on) I2
TJ: Junction Temperature.
TA: Ambient Temperature.
Rq = Thermal resistance between IC and air, through PCB.
RDS(on): Intrinsic resistance of the IC MOSFET.
I: load DC current.
Taking into account of Rtheta obtain with:
1 oz, 2 layers: 100°C/W.
At 2 A, 25°C ambient temperature, RDS(on) 42 mW @ VIN
4.2 V, the junction temperature will be:
TJ + TA ) Rq Pd + 25 ) ǒ0.042 22Ǔ 100 + 41.8° CńW
Taking into account of Rq obtain with:
2 oz, 4 layers: 60°C/W.
At 2 A, 25°C ambient temperature, RDS(on) 42 mW @ VIN
4.2 V, the junction temperature will be:
TJ + TA ) Rq Pd + 25 ) ǒ0.042 22Ǔ 60 + 35° C.
ORDERING INFORMATION
Device
Marking
Package
Shipping†
NCP334FCT2G
AD
WLCSP 0.96 x 0.96 mm
(Pb−Free)
3000 / Tape & Reel
NCP335FCT2G
AA
WLCSP 0.96 x 0.96 mm
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
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