MSM7716P データシートの表示（PDF） - Oki Electric Industry

部品番号

コンポーネント説明

メーカー

MSM7716P

Single Rail Linear CODEC

Oki Electric Industry 

OKI Semiconductor

PACKAGE DIMENSIONS

SSOP30-P-56-0.65-K

Mirror finish

FEDL7716P-01

MSM7716P

(Unit: mm)

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

0.19 TYP.

5/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

21/23

Share Link: