OKI Semiconductor
FEDL7716P-01
MSM7716P
NOTES ON USE
• To ensure proper electrical characteristics, use bypass capacitors with excellent high frequency characteristics for
the power supply and keep them as close as possible to the device pins.
• Connect the AG pin and the DG pin as close as possible. Connect to the system ground with low impedance.
• Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If the use of IC socket is
unavoidable, use the short lead type socket.
• When mounted on a frame, use electro-magnetic shielding, if any electro-magnetic wave sources such as power
supply transformers surround the device.
• Keep the voltage on the VDD pin not lower than –0.3 V even instantaneously to avoid latch-up that may otherwise
occur when power is turned on.
• Use a low noise (particularly, low level type of high frequency spike noise or pulse noise) power supply to avoid
erroneous operation and the degradation of the characteristics of these devices.
20/23