MRFIC1504 データシートの表示（PDF） - Motorola => Freescale
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MRFIC1504 Datasheet PDF : 8 Pages
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ARCHIVED BY FREESCALE SEMICOFNrDeUeCsTOcRa, IlNeC.S2M0eR0m5FICic1o50n4ductor, Inc.
4X
0.200 AB T–U Z
9
A
A1
48
37
1
T
B
B1
12
13
S1
24
Z
S
4X
0.200 AC T–U Z
OUTLINE DIMENSIONS
PLASTIC PACKAGE
CASE 932–03
(LQFP–48)
ISSUE F
DETAIL Y
P
36
U
V
AE
V1
25
DETAIL Y
AB
G
0.080 AC
AD
AC
BASE METAL
ÇÇÇÉÉÉÇÇÇÉÉÉÇÇÇÉÉÉÇÇÇN J
F
D
0.080 M AC T–U Z
SECTION AE–AE
M_
TOP & BOTTOM
CE
H
W
DETAIL AD
NOTES:
1 DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
AE
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T, U, Z
MILLIMETERS
DIM MIN MAX
A 7.000 BSC
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
L 0 _ 7_
M
12 _REF
N 0.090 0.160
P 0.250 BSC
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
R
L_
K
AA
MOTOROLA RF/IF DEVICE DATA For More Information On This Product,
5
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