FEDR27V3252J-01-02 データシートの表示（PDF） - Oki Electric Industry

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コンポーネント説明

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FEDR27V3252J-01-02

2M–Word × 16–Bit or 4M–Word × 8–Bit Page Mode OTP

Oki Electric Industry 

OKI Semiconductor

PACKAGE DIMENSIONS

TSOP(1)48-P-1220-0.50-1K

Mirror finish

FEDR27V3252J-01-02

MR27V3252J / OTP

(Unit: mm)

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

0.55 TYP.

1/Dec. 2, 1999

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

10/12

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