MPVZ7025G6U データシートの表示（PDF） - Freescale Semiconductor

部品番号

コンポーネント説明

一致するリスト

MPVZ7025G6U

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Freescale Semiconductor 

PACKAGE DIMENSIONS

Pressure

2 PLACES 4 TIPS

0.008 (0.20) C A B

A

E

e

5

4

e/2

D

GAGE

PLANE

.014 (0.35)

θ

L

A1

DETAIL G

8

F

1

8X b

0.004 (0.1) M C A B

B

E1

∅T

N

K

A

M

8X 0.004 (0.1)

P

DETAIL G

C

SEATING

PLANE

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

INCHES MILLIMETERS

DIM MIN MAX MIN MAX

A 0.300 0.330 7.11 7.62

A1 0.002 0.010 0.05 0.25

b 0.038 0.042 0.96 1.07

D 0.465 0.485 11.81 12.32

E 0.717 BSC

18.21 BSC

E1 0.465 0.485 11.81 12.32

e 0.100 BSC

2.54 BSC

F 0.245 0.255 6.22 6.47

K 0.120 0.130 3.05 3.30

L 0.061 0.071 1.55 1.80

M 0.270 0.290 6.86 7.36

N 0.080 0.090 2.03 2.28

P 0.009 0.011 0.23 0.28

T 0.115 0.125 2.92 3.17

θ 0˚

7˚

0˚

7˚

CASE 1369-01

ISSUE O

SMALL OUTLINE PACKAGE

Sensors

Freescale Semiconductor

MPXV7025

9

Share Link: