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MPX2202ASX(2006) データシートの表示(PDF) - Freescale Semiconductor

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MPX2202ASX
(Rev.:2006)
Freescale
Freescale Semiconductor Freescale
MPX2202ASX Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Silicone Gel
Die Coat
Wire Bond
Differential/gauge
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Silicone Gel
Die Coat
Wire Bond
Absolute
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
Differential/Gauge Element
P2
Bond
Lead Frame
DIE
Absolute Element
P2
Die
Bond
Figure 4. Cross-Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2202/MPXV2202G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die from the environment. The differential
or gauge sensor is designed to operate with positive
differential pressure applied, P1 > P2. The absolute sensor is
designed for vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Table 3. Pressure (P1)/Vacuum (P2) Side Identification
Table
Part Number Case Type
Pressure (P1) Side
Identifier
MPX2202A/D
344 Stainless Steel Cap
MPX2202DP
344C Side with Part Marking
MPX2202AP/GP
344B Side with Port Attached
MPX2202ASX
344F Side with Port Attached
MPXV2202GP
1369 Side with Port Attached
MPXV2202DP
1351 Side with Part Marking
Sensors
Freescale Semiconductor
MPX2202
5

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