MPX2102AP(2012) データシートの表示（PDF） - Freescale Semiconductor
部品番号
コンポーネント説明
一致するリスト
MPX2102AP
(Rev.:2012)
(Rev.:2012)
Freescale Semiconductor
MPX2102AP Datasheet PDF : 17 Pages
| |||
Pressure
PACKAGE DIMENSIONS
C
B
J
R
M
-A-
PIN 1
1234
N
L
-T-
SEATING
PLANE
G
F
D 4 PL
0.136 (0.005) M T A M
12 34
F
Y
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
Z
16.00 (0.630).
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M
30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
Y 0.048 0.052 1.22 1.32
Z 0.106 0.118 2.68 3.00
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
STYLE 2:
PIN 1. VCC
2. - SUPPLY
3. + SUPPLY
4. GROUND
STYLE 3:
PIN 1. GND
2. -VOUT
3. VS
4. +VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
-T-
R
J
C
-A-
U
L
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
B
PIN 1
-P-
0.25 (0.010) M T Q S
12 34
F
G
D 4 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-Q-
K
S
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G
0.100 BSC
2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.230 0.250 5.84 6.35
S 0.220 0.240 5.59 6.10
U
0.910 BSC
23.11 BSC
0.13 (0.005) M T S S Q S
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2102
7
Sensors
Freescale Semiconductor, Inc.
Share Link: