MPX2202GVP データシートの表示（PDF） - Motorola => Freescale
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MPX2202GVP
Motorola => Freescale
MPX2202GVP Datasheet PDF : 12 Pages
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Freescale Semiconductor, MInPcX2. 202 MPXV2202G SERIES
LINEARITY
Linearity refers to how well a transducer’s output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the “best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
LEAST SQUARES FIT
EXAGGERATED
PERFORMANCE
CURVE
LEAST
SQUARE
DEVIATION
STRAIGHT LINE
DEVIATION
END POINT
STRAIGHT LINE FIT
OFFSET
0
50
100
PRESSURE (% FULLSCALE)
Figure 2. Linearity Specification Comparison
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the output characteristics of the
MPX2202/MPXV2202G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating Characteristics.
40 VS = 10 Vdc
35
TA = 25°C
P1 > P2
30
25
MAX
20
15
10
5
0
-ā5
kPa 0
PSI
25 50
7.25
TYP
MIN
SPAN
RANGE
(TYP)
75 100 125 150 175 200
14.5
21.75
29
PRESSURE
OFFSET
Figure 3. Output versus Pressure Differential
SILICONE GEL
DIE COAT
ÉÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND
DIFFERENTIAL/GAUGE
DIE
P1
STAINLESS STEEL
METAL COVER
EPOXY
CASE
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
DIE
DIFFERENTIAL/GAUGE ELEMENT
BOND
P2
SILICONE GEL
DIE COAT
ABSOLUTE
DIE
P1
ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
STAINLESS STEEL
METAL COVER
EPOXY
CASE
DIE
ABSOLUTE ELEMENT
BOND
P2
Figure 4. Cross–Sectional Diagrams (Not to Scale)
Figure 4 illustrates an absolute sensing die (right) and the
differential or gauge die in the basic chip carrier (Case 344).
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
The MPX2202/MPXV2202G series pressure sensor oper-
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Motorola Sensor Device Data For More Information On This Product,
3
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