MPVZ2202 データシートの表示（PDF） - Freescale Semiconductor

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MPVZ2202

200 kPa On-Chip Temperature Compensated & Calibrated Pressure Sensors

Freescale Semiconductor 

Gel Die Coat

Wire Bond

Lead Frame

Die

P1

Stainless

Steel Cap

Thermoplastic

Case

P2

Differential Sensing

Element

Die Bond

Figure 4. Cross-Sectional Diagram (Not to Scale)

Figure 4 illustrates an absolute sensing die (right) and the

differential or gauge die in the basic chip carrier (Case 344).

A gel isolates the die surface and wire bonds from the

environment, while allowing the pressure signal to be

transmitted to the silicon diaphragm.

Operating characteristics, internal reliability and

qualification tests are based on use of dry clean air as the

pressure media. Media other than dry clean air may have

adverse effects on sensor performance and long term

reliability. Contact the factory for information regarding media

compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing the gel which

isolates the die from the environment. The differential or

gauge sensor is designed to operate with positive differential

pressure applied, P1 > P2. The absolute sensor is designed

for vacuum applied to P1 side.

The Pressure (P1) side may be identified by using the

table below:

Table 3. Pressure (P1)/Vacuum (P2) Side Identification

Table

Part Number Case Type

Pressure (P1) Side

Identifier

MPVZ2202GC6T1

482A Top with Port Attached

MPVZ2202GC7U

482C Top with Port Attached

Sensors

Freescale Semiconductor

MPVZ2202

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