MPVZ12G(2006) データシートの表示（PDF） - Freescale Semiconductor
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MPVZ12G Datasheet PDF : 14 Pages
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Gel Die Coat
Wire Bond
Lead Frame
Die
P1
Stainless
Steel Cap
Thermoplastic
Case
P2
Differential Sensing
Element
Die Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (applicable to cases 482, 1560 and
1735). A gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
Operating characteristics, internal reliability and
qualification tests are based on use of dry clean air as the
pressure media. Media other than dry clean air may have
adverse effects on sensor performance and long term
reliability. Contact the factory for information regarding media
compatibility in your application.
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing gel which isolates
the die from the environment. The Freescale MPVZ12 series
is designed to operate with positive differential pressure
applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table
Part Number
Case Type
MPVZ12GC6U
MPVZ12GC7U
482A
98ASB17757C
482C
98ASB17759C
MPVZ12GW6U
1735
98ASA10686D
MPVZ12GW7U
1560
98ASA10611D
Pressure (P1) Side
Identifier
Top with Port Attached
Top with Port Attached
Top with Port Attached
Top with Port Attached
Sensors
Freescale Semiconductor
MPVZ12
5
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