908E622 データシートの表示（PDF） - Freescale Semiconductor

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908E622

Integrated Quad Half-Bridge, Triple High-Side and EC Glass Driver with Embedded MCU and LIN for High End Mirror

Freescale Semiconductor 

Maximum Ratings

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding limits on any terminal may cause permanent

damage to the device.

Electrical Ratings

Rating

Symbol

Value

Unit

Supply Voltage

V

Analog Chip Supply Voltage under Normal Operation (Steady-State)

VSUP(SS)

-0.3 to 28

Analog Chip Supply Voltage under Transient Conditions (1)

VSUP(PK)

-0.3 to 40

MCU Chip Supply Voltage

VDD

-0.3 to 5.5

Input Terminal Voltage

Analog Chip

Microcontroller Chip

V

VIN (ANALOG)

-0.3 to 5.5

VIN (MCU)

VSS-0.3 to VDD+0.3

Maximum Microcontroller Current per Terminal

All Terminals except VDD, VSS, PTA0:PTA4

PTA0:PTA4

IPIN(1)

IPIN(2)

mA

±15

± 25

Maximum Microcontroller VSS Output Current

Maximum Microcontroller VDD Input Current

LIN Supply Voltage

Normal Operation (Steady-State)

Transient Input Voltage (per ISO7637 Specification) and with

External Components (Figure 4, page 18)

IMVSS

IMVDD

VBUS(SS)

VBUS(PK)

100

mA

100

mA

V

-18 to 40

-150 to 100

ESD Voltage

Human Body Model (2) H0 terminal

Human Body Model (2) all other terminals

Machine Model (3)

Charge Device Model (4)

V

VESD1-1

VESD1-2

VESD2

VESD3

±1000

±2000

±200

± 750

Notes

1. Transient capability for pulses with a time of t < 0.5 sec.

2. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).

3. ESD2 testing is performed in accordance with the Machine Model (CZAP =200 pF, RZAP = 0 Ω).

4. ESD3 testing is performed in accordance with Charge Device Model, Robotic (CZAP = 4.0 pF).

908E622

6

Analog Integrated Circuit Device Data

Freescale Semiconductor

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