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MCP9700-E/TO データシートの表示(PDF) - Microchip Technology

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MCP9700-E/TO
Microchip
Microchip Technology Microchip
MCP9700-E/TO Datasheet PDF : 22 Pages
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MCP9700/9700A and MCP9701/9701A
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameter
Sym
Min
Typ
Max Unit
Conditions
Typical Load Capacitance
CLOAD
1000
pF The MCP9700/9700A and
MCP9701/9701A family is
characterized and produc-
tion tested with a capacitive
load of 1000 pF.
SC-70 Thermal Response to 63%
tRES
TO-92 Thermal Response to 63%
tRES
1.3
1.65
s 30°C (Air) to +125°C
s (Fluid Bath) (Note 3)
Note 1: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
2: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2. Also refer to Figure 2-16.
3: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
M
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load.
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load.
Parameters
Sym
Min
Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range (Note 1)
TA
-40
— +125
°C MCP9700/9700A
TA
-10
— +125
°C MCP9701/9701A
TA
-40
— +150
°C High Temperature,
MCP9700 only
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
TA
-40
— +125
°C Extended Temperature
TA
-40
— +150
°C High Temperature
TA
-65
— +150
°C
Thermal Resistance, 5LD SC70
θJA
331
°C/W
Thermal Resistance, 3LD SOT-23
θJA
308
°C/W
Thermal Resistance, 3LD TO-92
θJA
146
°C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
DS21942E-page 4
© 2009 Microchip Technology Inc.

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