![](/html/Sony/49266/page8.png)
Package Outline
Unit: mm
CXD3400N
20PIN SSOP (PLASTIC)
∗6.5 ± 0.1
20
11
A
+ 0.2
1.25 – 0.1
0.1
1
10
0.65
b
0.13 M
0.1 ± 0.1
b=0.22 ± 0.03
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SSOP-20P-L01
SSOP020-P-0044
DETAIL B : PALLADIUM
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
PALLADIUM PLATING
COPPER ALLOY
0.1g
–8–