MC100E151FNG データシートの表示（PDF） - ON Semiconductor
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MC100E151FNG Datasheet PDF : 8 Pages
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MC10E151, MC100E151
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
fMAX
tPLH
tPHL
ts
th
tRR
tPW
tSKEW
Maximum Toggle Frequency
900 1100
Propagation Delay to Output CLK, MR 575 650 900
900 1100
575 650 900
900 1100
MHz
575 650 900 ps
Setup TIme
D 0 −175
0 −175
0 −175
ps
Hold Time
D 350 175
350 175
350 175
ps
Reset Recovery Time
750 550
750 550
750 550
Minimum Pulse Width
CLK, MR 400
400
400
ps
Within-Device Skew (Note 10)
65
65
65
ps
tJITTER
Random Clock Jitter (RMS)
<1
<1
<1
ps
tr, tf
Rise/Fall Times
(20 - 80%) 300 450 700 300 450 700 300 450 700 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
Q
Driver
Device
Q
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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