MC100E155FN データシートの表示（PDF） - ON Semiconductor
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MC100E155FN Datasheet PDF : 8 Pages
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MC10E155, MC100E155
Table 8. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = −5.0 V (Note 9)
0°C
25°C
85°C
Symbol
fMAX
tPLH
tPHL
Characteristic
Maximum Toggle Frequency
Propagation Delay to Output
Min Typ Max Min Typ Max Min Typ Max Unit
700 1100
700 1100
700 1100
MHz
ps
D 325 500 700 325 500 700 325 500 700
SEL 475 675 925 475 675 925 475 675 925
LEN 350 500 750 350 500 750 350 500 750
MR 450 600 850 450 600 850 450 600 850
ts
Setup Time
ps
D 300 100
300 100
300 100
SEL 500 250
500 250
500 250
th
Hold Time
ps
D 300 −100
300 −100
300 −100
SEL 0 −250
0 −250
0 −250
tRR
Reset Recovery Time
tPW
Minimum Pulse Width
800 650
800 650
800 650
ps
ps
MR 400
400
400
tSKEW
tJITTER
tr
tf
Within-Device Skew (Note 10)
Random Clock Jitter (RMS)
Rise/Fall Time
(20 - 80%)
75
75
75
ps
<1
<1
<1
ps
ps
300 450 800 300 450 800 300 450 800
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
9. 10 Series: VEE can vary −0.46 V / +0.06 V.
100 Series: VEE can vary −0.46 V / +0.8 V.
10. Within-device skew is defined as identical transitions on similar paths through a device.
Q
Driver
Device
Q
Zo = 50 W
Zo = 50 W
50 W
50 W
D
Receiver
Device
D
VTT
VTT = VCC − 2.0 V
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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