MC74HCT08A(2014) データシートの表示（PDF） - ON Semiconductor

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MC74HCT08A
(Rev.:2014)

Quad 2-Input AND Gate with LSTTL Compatible Inputs

ON Semiconductor 

MC74HCT08A

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

VCC DC Supply Voltage (Referenced to GND)

−0.5 to +7.0

V

Vin DC Input Voltage (Referenced to GND)

−0.5 to VCC +0.5

V

Vout DC Output Voltage (Referenced to GND)

−0.5 to VCC +0.5

V

Iin

DC Input Current, per Pin

±20

mA

Iout DC Output Current, per Pin

±25

mA

ICC DC Supply Current, VCC and GND Pins

±50

mA

PD

Power Dissipation in Still Air,

SOIC Package†

500

mW

TSSOP Package†

450

Tstg Storage Temperature

−65 to +150

°C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

°C

SOIC or TSSOP Package

260

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of

these limits are exceeded, device functionality should not be assumed, damage may occur and

reliability may be affected.

†Derating − SOIC Package: − 7 mW/°C from 65°C to 125°C

TSSOP Package: − 6.1 mW/°C from 65°C to 125°C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

VCC

Vin, Vout

DC Supply Voltage (Referenced to GND)

DC Input Voltage, Output Voltage

(Referenced to GND)

TA

Operating Temperature, All Package Types

tr, tf Input Rise and Fall Time

(Figure 3)

VCC = 2.0 V

VCC = 4.5 V

VCC = 6.0 V

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

Min

Max Unit

2.0

6.0

V

0

VCC

V

−55

+125 °C

0

1000

ns

0

500

0

400

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