NLV74HC04ADG(2013) データシートの表示（PDF） - ON Semiconductor
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NLV74HC04ADG Datasheet PDF : 9 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
14
1
SCALE 1:1
SOIC−14 NB
CASE 751A−03
ISSUE L
DATE 03 FEB 2016
D
14
H
1
0.25 M B M
A
B
8
E
7
13X b
0.25 M C A S B S
A
0.10
e
A1
C
SEATING
PLANE
SOLDERING FOOTPRINT*
6.50
1
14X
1.18
L
DETAIL A
h
X 45 _
M
14X
0.58
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
A3
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DETAIL A
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 1.35 1.75 0.054 0.068
A1 0.10 0.25 0.004 0.010
A3 0.19 0.25 0.008 0.010
b 0.35 0.49 0.014 0.019
D 8.55 8.75 0.337 0.344
E 3.80 4.00 0.150 0.157
e
1.27 BSC
0.050 BSC
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.019
L 0.40 1.25 0.016 0.049
M 0_ 7_ 0_ 7_
GENERIC
MARKING DIAGRAM*
14
XXXXXXXXXG
AWLYWW
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
Y
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2
DOCUMENT NUMBER: 98ASB42565B
DESCRIPTION: SOIC−14 NB
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
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