33291 データシートの表示（PDF） - Motorola => Freescale

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33291

Eight Output Switch with Serial Peripheral Interface I/O

Motorola => Freescale 

Freescale Semiconductor, Inc.

MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted.

Rating

Power Supply Voltage

Normal Operation (Steady-State)

Transient Conditions (Note 1)

Logic Supply Voltage (Note 2)

Input Pin Voltage (Note 3)

Output Clamp Voltage (Note 4)

5.0 mA ≤ Iout ≤ 0.5 A

Symbol

VPWR(SUS)

VPWR(PK)

VDD

VIN

VOUT(OFF)

Value

Unit

V

- 1.5 to 26.5

- 13 to 60

- 0.3 to 7.0

V

- 0.3 to 7.0

V

V

45 to 65

Output Self-Limit Current

Continuous Per Output Current (Note 5)

ESD Voltage (Note 6)

Human Body Model (Note 7)

Machine Model (Note 8)

Output Clamp Energy (Note 9)

Recommended Frequency of SPI Operation

Storage Temperature

Operating Case Temperature

Operating Junction Temperature

Power Dissipation (TA = 25° C) (Note 10)

IOUT(LIM)

IOUT(CONT)

VESD1

VESD2

ECLAMP

fSPI

TSTG

TC

TJ

PD

1.0 to 3.0

500

2000

200

50

3.0

- 55 to 150

- 40 to 125

- 40 to 150

2.0

A

mA

V

mJ

MHz

°C

°C

°C

W

Soldering Temperature (Note 11)

TSOLDER

260

°C

Thermal Resistance (Junction-to-Ambient)

Case 751E-04 Package

All Outputs ON (Note 12)

Single Output ON (Note 13)

RθJA

°C/W

45

60

Notes:

1. Transient capability with external 100 Ω resistor in series with VP pin and supply.

2. Exceeding these limits may cause a malfunction or permanent damage to the device.

3. Exceeding the limits on SCLK, SI, CS, SFPD, or RST pins may cause permanent damage to the device.

4. With output OFF.

5. Continuous output current rating so long as maximum junction temperature is not exceeded. Operation at 125°C ambient temperature will

require maximum output current computation using package RθJA.

6. ESD data available upon request.

7. ESD1 testing is performed in accordance with the Human Body Model (CZap = 200 pF, RZap = 1500 Ω).

8. ESD2 testing is performed in accordance with the Machine Model (CZap = 200pF, RZap = 0 Ω).

9. Maximum output clamp energy capability at 150°C junction temperature using a single non-repetitive pulse method.

10. Maximum power dissipation at indicated junction temperature with no heat sink used.

11. Lead soldering temperature limit is for 10 seconds maximum duration; not designed for immersion soldering; exceeding these limits may

cause malfunction or permanent damage to the device.Contact Motorola Sales Office for device immersion soldering time/temperature limits.

12. Thermal resistance from Junction-to-Ambient with all outputs ON and dissipating equal power.

13. Thermal resistance from Junction -to-Ambient with a single output ON.

33291

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