MASW-002102-13580 データシートの表示（PDF） - M/A-COM Technology Solutions, Inc.

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MASW-002102-13580

HMIC™ Silicon PIN Diode Switches with Integrated Bias Network

M/A-COM Technology Solutions, Inc. 

MASW-002102-13580

MASW-003102-13590

HMIC™ Silicon PIN Diode Switches

with Integrated Bias Network

Rev. V5

Wire/Ribbon and Die Attachment Recommendations

Wire Bonding

Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is

recommended. A heat stage temperature of 150oC and a force of 18 to 22 grams should be used. Ultrasonic

energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as

short and straight as possible.

Chip Mounting

The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder

preform or conductive epoxy. Mounting surface must be clean and flat.

*Note: This device utilizes a process step designed to have minimal to non-existent burring around the

perimeter of the die.

Eutectic Die Attachment: An 80/20, gold-tin, eutectic solder preform is recommended with a work surface

temperature of 255oC and a tool tip temperature of 265oC. When hot gas is applied, the tool tip temperature

should be 290oC. The chip should not be exposed to temperatures greater than 320oC for more than

20 seconds. No more than three seconds should be required for attachment. Solders containing tin should not

be used.

Epoxy Die Attachment: A minimum amount of epoxy should be used. A thin epoxy fillet should be visible

around the perimeter of the chip after placement. Cure epoxy per manufacturer’s schedule (typically 125-

150oC).

MASW-002102-13580 Chip Outline Drawing1,2

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A

0.066

0.070

1.680

1.780

B

0.048

0.052

1.230

1.330

C

0.004

0.006

0.100

0.150

D

0.004

0.006

0.090

0.140

E

0.012

0.013

0.292

0.317

F

0.029

0.030

0.735

0.760

G

0.030

0.031

0.766

0.791

H

0.029

0.030

0.732

0.757

J

0.005

REF.

0.129

REF.

K

0.005

REF.

0.129

REF.

Notes:

1. Topside and backside metallization is gold, 2.5um thick typical.

2. Yellow areas indicate wire bonding pads

6

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

Commitment to produce in volume is not guaranteed.

changes to the product(s) or information contained herein without notice.

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