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MAC08BT1 データシートの表示(PDF) - ON Semiconductor

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MAC08BT1
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MAC08BT1 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
MAC08BT1, MAC08MT1
Preferred Device
Sensitive Gate Triacs
Silicon Bidirectional Thyristors
Designed for use in solid state relays, MPU interface, TTL logic and
other light industrial or consumer applications. Supplied in surface
mount package for use in automated manufacturing.
Features
Sensitive Gate Trigger Current in Four Trigger Modes
Blocking Voltage to 600 Volts
Glass Passivated Surface for Reliability and Uniformity
Surface Mount Package
Pb−Free Packages are Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Peak Repetitive Off−State Voltage (Note 1) VDRM,
V
(Sine Wave, 50 to 60 Hz, Gate Open,
VRRM
TJ = 25 to 110°C)
MAC08BT1
200
MAC08MT1
600
On−State Current RMS (TC = 80°C)
IT(RMS)
0.8
A
(Full Sine Wave 50 to 60 Hz)
Peak Non−repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz,
TC = 25°C)
Circuit Fusing Considerations
(Pulse Width = 8.3 ms)
ITSM
I2t
8.0
A
0.4
A2s
Peak Gate Power
(TC = 80°C, Pulse Width v 1.0 ms)
PGM
5.0
W
Average Gate Power
(TC = 80°C, t = 8.3 ms)
PG(AV)
0.1
W
Operating Junction Temperature Range
TJ
−40 to +110 °C
Storage Temperature Range
Tstg −40 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
PCB Mounted per Figure 1
RqJA
156
°C/W
Thermal Resistance, Junction−to−Tab
Measured on MT2 Tab Adjacent to Epoxy
RqJT
25
°C/W
Maximum Device Temperature for
TL
Soldering Purposes for 10 Secs Maximum
260
°C
© Semiconductor Components Industries, LLC, 2005
1
December, 2005 − Rev. 5
http://onsemi.com
TRIAC
0.8 AMPERE RMS
200 thru 600 VOLTS
MT2
MT1
G
MARKING
DIAGRAM
4
SOT−223
CASE 318E
STYLE 11
AYW
AC08x G
G
12 3
A
= Assembly Location
Y
= Year
W
= Work Week
AC08X = Device Code
x= B or M
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
1
Main Terminal 1
2
Main Terminal 2
3
Gate
4
Main Terminal 2
ORDERING INFORMATION
Device
Package
Shipping
MAC08BT1
SOT−223 1000 Tape & Reel
MAC08BT1G
SOT−223 1000 Tape & Reel
(Pb−Free)
MAC08MT1
SOT−223 1000 Tape & Reel
MAC08MT1G SOT−223 1000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MAC08BT1/D

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