MAAPGM0034-DIE データシートの表示（PDF） - Tyco Electronics
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MAAPGM0034-DIE Datasheet PDF : 6 Pages
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0.5W X/Ku-Band Power Amplifier
RO-P-DS-3019 A 5/6
MAAPGM0034-DIE
Mechanical Information
Chip Size: 2.480 x 1.580 x 0.075 mm (98 x 62 x 3 mils)
1.580 mm.
1.428 mm.
0.790 mm.
0.152 mm.
0
0
0.790 mm.
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
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Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
Visit www.macom.com for additional data sheets and product information.
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