MAAPGM0027-DIE データシートの表示（PDF） - Tyco Electronics
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MAAPGM0027-DIE Datasheet PDF : 6 Pages
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2.0-4.0 GHz 1W Power Amplifier
RFIN
100 pF
MAAPGM0027-DIE
RO-P-DS-3014 B
Preliminary Information
VDD
0.1 μF
RFOUT
100 pF
VGG
0.1 μF
Figure 6. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization fixture for CW test-
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
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Visit www.macom.com for additional data sheets and product information.
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