MAAP-000074-PED000 データシートの表示（PDF） - Tyco Electronics
部品番号
コンポーネント説明
一致するリスト
MAAP-000074-PED000 Datasheet PDF : 8 Pages
| |||
Amplifier, Power, 8W
2.0-8.0 GHz
Mechanical Information
Chip Size: 5.204 x 6.550 x 0.356 mm (204 x 258 x 14 mils)
MAAP-000074-PED000
Rev —
Preliminary Datasheet
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 17. Die Layout
Bond Pad Dimensions
Pad
RF In and Out
Pad No.
1
Size (μm)
100 x 200
Size (mils)
4x8
DC Drain Supply Voltage VD1
2
DC Drain Supply Voltage VD2
3
DC Gate Supply Voltage VG1
4
DC Gate Supply Voltage VG2
5
6
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
200 x 150
8x6
500 x 200
150 x 150
150 x 125
20 x 8
6x6
6x5
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
Share Link: 