PACKAGE OUTLINE
MITSUBISHI SEMICONDUCTORS <HVIC>
M63992FP
HIGH VOLTAGE HALF BRIDGE DRIVER
16P2N-A
EIAJ Package Code
SOP16-P-300-1.27
JEDEC Code
–
Weight(g)
0.2
Lead Material
Cu Alloy
16
9
Plastic 16pin 300mil SOP
e
b2
1
D
b
e
F
8
A
A2
A1
y
c
Detail F
Recommended Mount Pad
Symbol
A
A1
A2
b
c
D
E
e
HE
L
L1
y
b2
e1
I2
Dimension in Millimeters
Min Nom Max
–
–
2.1
0
0.1
0.2
–
1.8
–
0.35 0.4
0.5
0.18 0.2
0.25
10.0 10.1 10.2
5.2
5.3
5.4
–
1.27
–
7.5
7.8
8.1
0.4
0.6
0.8
–
1.25
–
–
–
0.1
0°
–
8°
–
0.76
–
–
7.62
–
1.27
–
–
Sep. 2000