M541 データシートの表示（PDF） - M/A-COM Technology Solutions, Inc.

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M541

Bonding, Handling, and Mounting Procedures for Chip Diode Devices

M/A-COM Technology Solutions, Inc. 

Application Note

M541

Bonding, Handling, and Mounting Procedures for

Chip Diode Devices

M/A-COM Products

Rev. V3

Figure 3. Die Bonding Criteria

Table 2. Visual Inspection for Good Die-Down Bonds (Using a 5-15x Microscope)

Die Down

Method

Conductive Epoxy

Soft Solder

Gold-tin Eutectic Solder

Thermal Compression Bond

Visual

(Good Bond Criteria)

Flat and max epoxy thickness

~0.001 inch - 90% min wetting

Flat - max solder thickness

0.001 inch - 90% min wetting

Flat - max solder thickness

0.001 inch - 90% min wetting

Flat - 90% min wetting

Typical Bond Strength

(In Stress)

~ 50-100 kgms/cm2

Extra Rs From1

Die Down (0.020” Chip)

Less than 0.15 ohms

~ 70-100 kgms/cm2

Less than 0.10 ohms

~ 100-150 kgms/cm2

~ 100 kgms/cm2

Less than 0.10 ohms

Less than 0.10 ohms

Note: 1. This is the approximate extra RF series resistance from an ideal lossless bond of 0.020” x 0.020” chip

Table 3. Methods for Top-Bonding Diode Chips

Type of Chip

Type of Circuit Board

Ceramic

Teflon Fiberglass Metal Ground

Planer Chip with Gold Metal on Anode

Wedge bond 0.002 diameter gold wire or 0.001 x 0.005 strap.

Bonding tool must be smaller than anode pad.

Beam Lead

Schottky Diodes with Planer Contacts

Ultrasonic bond

Bonding tip size 0.002 minimum

Special tools are available for beam leads

NOT RECOMMENDED

Wedge bond 0.0007 diameter gold wire.

Bonding tip size 0.001 maximum

Hermetic CERMACHIP ™

Planer Chips with Very Small Node

Pads (less than 0.002)

Wedge bond.

0.001 x 0.005 strap is best

Bonding tip size 0.005 maximum

Wedge bond, or parallel gap

Or welded strap

Wedge bond 0.0007 to 0.001 diameter gold wire.

Bonding tip size 0.001 maximum

Mesa Diodes (Small)

4

Wedge bond. Use 5 mil strap, if possible

Bonding tool tip size 0.001 to 0.002.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

• India Tel: +91.80.43537383

• China Tel: +86.21.2407.1588

Visit www.macomtech.com for additional data sheets and product information.

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

Commitment to produce in volume is not guaranteed.

changes to the product(s) or information contained herein without notice.

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