LX8630-00CDD データシートの表示（PDF） - Microsemi Corporation
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LX8630-00CDD Datasheet PDF : 9 Pages
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A MICROSEMI COMPANY
LX8630-xx
3A BiCMOS Very Low Dropout Regulators
PRODUCTION DATA SHEET
Input Voltage (VIN) ......................................................................................................6.5V
SHDN Pin..............................................................................................-0.3V to VIN +0.3V
Operating Junction Temperature
Plastic (P & DD Packages)................................................................................... 150°C
Storage Temperature Range ........................................................................-65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................... 300°C
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
P PLASTIC TO-220 3-PIN
THERMAL RESISTANCE-JUNCTION TO TAB , θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
2.1°C/W
60°C/W
P PLASTIC TO-220 5-PIN
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
2.1°C/W
60°C/W
DD PLASTIC TO-263 3-PIN
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
2.1°C/W
60°C/W
DD PLASTIC TO-263 5-PIN
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
2.1°C/W
60°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow.
• θJA can be improved with package soldered to 0.5IN2 copper area over backside
ground plane or internal power plane. θJA can vary from 20°C/W to > 40°C/W
depending on mounting technique. See table below for thermal resistance
guidelines:
Copper Area
(Topside)*
2.5 sq” (1613mm2)
1.0 sq” (645 mm2)
0.17 sq” (110 mm2)
Copper Area
(Backside)*
2.5 sq” (1613mm2)
2.5 sq” (1613mm2)
2.5 sq” (1613mm2)
Board Area
2.5 sq” (1613mm2)
2.5 sq” (1613mm2)
2.5 sq” (1613mm2)
Thermal
Resistance
(θJA)
25°C/W
27°C/W
35°C/W
*Tab of device attached to topside copper
TAB is GND
3
VOUT
2
GND
1
VIN
DD PACKAGE (3-PIN)
(Top View)
TAB is GND
5
VOUT
4
ADJ
3
GND
2
SHDN
1
V IN
DD PACKAGE (5-PIN)
(Top View)
TAB is G ND
5
4
3
2
1
P PACKAGE (5-PIN)
(Top View)
VOUT
ADJ
GND
SHDN
VIN
TAB is GND
3
2
1
P PACKAGE (3-PIN)
(Top View)
VOUT
GND
VIN
Copyright © 2000
Rev. 1.0a,2000-11-28
Microsemi
Linfinity Microelectronics Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2
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