LX5512ELQ データシートの表示（PDF） - Microsemi Corporation
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LX5512ELQ Datasheet PDF : 11 Pages
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LX5512E
TM
®
InGaP HBT 2.4 – 2.5 GHz Power Amplifier
PRODUCTION DATA SHEET
LQ
16-Pin MLPQ 3x3
D
E
A1
A3
PACKAGE DIMENSIONS
b E2
L
D2
e
or
K
A
or
Pin 1 Indicator
Dim
MILLIMETERS
MIN MAX
INCHES
MIN MAX
A 0.80 1.00 0.031 0.039
A1
0
0.05
0 0.002
A3
0.20 REF
0.008 REF
b 0.18 0.30 0.007 0.012
D
3.00 BSC
0.118 BSC
E
3.00 BSC
0.118 BSC
e
0.50 BSC
0.020 BSC
D2 1.30 1.55 0.051 0.061
E2 1.30 1.55 0.051 0.061
K
0.2
-
0.008
-
L 0.35 0.50 0.012 0.020
L1
-
0.15
-
0.006
Or
D
E
b E2 L
D2
Note:
1. Dimensions do not include mold flash or
protrusions; these shall not exceed 0.155mm(.006”)
on any side. Lead dimension shall not include
solder coverage.
2. Due to multiple qualified assembly sub-contractors
either package (with different pin one indicators)
may be shipped. Package type will be consistent
within the smallest individual container.
L1
e
A1
A
K
Copyright © 2003
Rev. 2.0c, 2005-08-18
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 10
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