LT3782AIFE(RevC) データシートの表示（PDF） - Linear Technology

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LT3782AIFE
(Rev.:RevC)

2-Phase Step-Up DC/DC Controller

Linear Technology 

LT3782A

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

UFD Package

28-Lead PUlaFsDtiPcaQcFkNag(4emm × 5mm)

28(R-LefeearedncPelaLTsCtiDcWQGFN# 0(54-m08m-17×152mRemv )B)

(Reference LTC DWG # 05-08-1712 Rev B)

0.70 ±0.05

4.50 ±0.05

3.10 ±0.05

2.50 REF

2.65 ±0.05

3.65 ±0.05

PACKAGE OUTLINE

0.25 ±0.05

0.50 BSC

3.50 REF

4.10 ±0.05

5.50 ±0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

4.00 ±0.10

(2 SIDES)

0.75 ±0.05

PIN 1

TOP MARK

(NOTE 6)

5.00 ±0.10

(2 SIDES)

R = 0.05

TYP

2.50 REF

R = 0.115

TYP

27

PIN 1 NOTCH

R = 0.20 OR 0.35

× 45° CHAMFER

28

0.40 ±0.10

1

2

3.50 REF

3.65 ±0.10

2.65 ±0.10

18

0.200 REF

0.00 – 0.05

(UFD28) QFN 0506 REV B

0.25 ±0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

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For more information www.linear.com/LT3782A

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