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LT3028

Dual 100mA/500mA Low Dropout, Low Noise, Micropower Regulators with Independent Inputs

Linear Technology

LT3028 Datasheet PDF : 16 Pages

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LT3028

APPLICATIO S I FOR ATIO

Voltage and temperature coefficients are not the only

sources of problems. Some ceramic capacitors have a

piezoelectric response. A piezoelectric device generates

voltage across its terminals due to mechanical stress,

similar to the way a piezoelectric accelerometer or

microphone works. For a ceramic capacitor the stress

can be induced by vibrations in the system or thermal

transients. The resulting voltages produced can cause

appreciable amounts of noise, especially when a ceramic

capacitor is used for noise bypassing. A ceramic capaci-

tor produced Figure 6’s trace in response to light tapping

from a pencil. Similar vibration induced behavior can

masquerade as increased output voltage noise.

COUT = 10µF

CBYP = 0.01µF

ILOAD = 100mA

VOUT

500µV/DIV

100ms/DIV

3028 F05

Figure 6. Noise Resulting from Tapping on a Ceramic Capacitor

Thermal Considerations

The power handling capability of the device will be limited

by the maximum rated junction temperature (125°C). The

power dissipated by the device will be made up of two

components for each output:

1. Output current multiplied by the input/output voltage

differential: (IOUT)(VIN – VOUT), and

2. GND pin current multiplied by the input voltage:

(IGND)(VIN).

The ground pin current can be found by examining the

GND Pin Current curves in the Typical Performance Char-

acteristics section. Power dissipation will be equal to the

sum of the two components listed above.

The LT3028 regulator has internal thermal limiting de-

signed to protect the device during overload conditions.

For continuous normal conditions, the maximum junction

temperature rating of 125°C must not be exceeded. It is

important to give careful consideration to all sources of

thermal resistance from junction to ambient. Additional

heat sources mounted nearby must also be considered.

For surface mount devices, heat sinking is accomplished

by using the heat spreading capabilities of the PC board

and its copper traces. Copper board stiffeners and plated

through-holes can also be used to spread the heat gener-

ated by power devices.

The following tables list thermal resistance for several

different board sizes and copper areas. All measurements

were taken in still air on 3/32" FR-4 board with one ounce

copper.

Table 1. FE Package, 16-Lead TSSOP

COPPER AREA

TOPSIDE* BACKSIDE

2500mm2 2500mm2

1000mm2 2500mm2

225mm2 2500mm2

100mm2 2500mm2

BOARD AREA

2500mm2

THERMAL RESISTANCE

(JUNCTION-TO-AMBIENT)

38°C/ W

43°C/ W

48°C/ W

60°C/ W

*Device is mounted on topside.

Table 2. DHC Package, 16-Lead DFN

COPPER AREA

THERMAL RESISTANCE

TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)

2500mm2

1000mm2

225mm2

100mm2

2500mm2

40°C/ W

45°C/ W

50°C/ W

62°C/ W

*Device is mounted on topside.

The thermal resistance junction-to-case (θJC), measured

at the Exposed Pad on the back of the die is 10°C/W for the

DFN package and 8°C/W for the TSSOP package.

Calculating Junction Temperature

Example: Given Output 1 set for an output voltage of 3.3V,

Output 2 set for an output voltage of 2.5V, an input voltage

range of 3.8V to 5V, an output current range of 0mA to

500mA for Output 1, an output current range of 0mA to

100mA for Output 2 and a maximum ambient temperature

of 50°C, what will the maximum junction temperature be?

3028f

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