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LIS2L02AL(2005) データシートの表示(PDF) - STMicroelectronics

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LIS2L02AL Datasheet PDF : 17 Pages
First Prev 11 12 13 14 15 16 17
LIS2L02AL
6 Package Information
6 Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second Level
Interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 15. LGA-8 Mechanical Data & Package Dimensions
DIM.
A1
A2
A3
D1
E1
L
L1
M
M1
N
N1
N2
P1
P2
T1
T2
R
h
k
j
mm
MIN. TYP.
1.460 1.520
0.180 0.220
4.850 5.000
4.850 5.000
1.270
2.540
1.225
0.875 0.900
2.000
1.225
1.170
1.300 1.350
0.740 0.790
1.170
0.615 0.640
1.200
0.150
0.050
0.100
inch
MAX. MIN. TYP. MAX.
1.600 0.0574 0.0598 0.0629
1.330
0.0523
0.260 0.007 0.0086 0.0102
5.150 0.190 0.1968 0.2027
5.150 0.190 0.1968 0.2027
0.05
0.1
0.0482
0.925 0.0344 0.0354 0.0364
0.0787
0.0482
0.046
1.400 0.0511 0.0531 0.0551
0.840 0.0291 0.0311 0.033
0.046
0.665 0.0242 0.0251 0.0261
1.600 0.0472
0.0629
0.0059
0.0019
0.0039
OUTLINE AND
MECHANICAL DATA
LGA8 (5x5x1.6mm)
Land Grid Array Package
E1
A
K
(4x)
D
KE
A3
KC
R
E
M M1
T1
8
7
1
D
6
2
5
3
4
B
E
P1
DETAIL A
A2
A1
h CA B
seating plane
K
Detail A
SOLDER MASK
OPENING
METAL PAD
j CAB
7669231 C
CD00068420
15/17

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