APTB1615SRPGWPR
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: CDA0376
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: OCT/26/2001
DRAWN: Y.F.XU
PAGE: 4 OF 4