KP-1608SEC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0021
APPROVED: J. LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 4 OF 4