ISL8023 データシートの表示（PDF） - Intersil
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ISL8023 Datasheet PDF : 20 Pages
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ISL8023, ISL8024
PCB Layout Recommendation
The PCB layout is a very important converter design step to make
sure the designed converter works well. For ISL8023, ISL8024,
the power loop is composed of the output inductor L’s, the output
capacitor COUT, the PHASE’s pins, and the PGND pin. It is
necessary to make the power loop as small as possible and the
connecting traces among them should be direct, short and wide.
The switching node of the converter, the PHASE pins, and the
traces connected to the node are very noisy, so keep the voltage
feedback trace away from these noisy traces. The input capacitor
should be placed as close as possible to the VIN pin . The ground
of input and output capacitors should be connected as closely as
possible. The heat of the IC is mainly dissipated through the
thermal pad. Maximizing the copper area connected to the
thermal pad is preferable. In addition, a solid ground plane is
helpful for better EMI performance. It is recommended to add at
least 5 vias ground connection within the pad for the best
thermal relief.
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest revision.
DATE
REVISION
CHANGE
May 7, 2012
FN7812.2
Page 2: Updated with new silkscreen to show the correct placement of U1-Pin1.
Page 3: Pin Descriptions , COMP, FB Changed the description from "Must connect COMP to SGND in internal
compensation mode " to "Recommend connect COMP to SGND in internal compensation mode".
Updated Figure 3 to show the COMP pin tied to GND
Page 18: Put compensator zero ωcz2 = (5to8) R0C0" changed to "..... R2C3"
Figure 44, Simulated Loop Gain: Added Y-axis title to the top graph: GAIN (VLOOP(S(fi)))
February 15, 2012 FN7812.1 In the “Absolute Maximum Ratings” on page 6, changed “VIN” from “-0.3V” to “-0.3V to 6.5V (DC) or 7V (20ms)"
February 1, 2012
Revised description, Features and Applications on page 1. Added Figure 2.
December 22, 2011 FN7812.0 Initial Release.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products
address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks.
Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a
complete list of Intersil product families.
For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on
intersil.com: ISL8023, ISL8024
To report errors or suggestions for this datasheet, please go to: www.intersil.com/askourstaff
FITs are available from our website at: http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree
Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted
in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
19
FN7812.2
May 17, 2012
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