HM-6561 データシートの表示（PDF） - Intersil
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HM-6561 Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
132 x 160 x 19 ±1mils
METALLIZATION:
Type: Si - Al
Thickness: 11kÅ ±2kÅ
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ±1kÅ
Metallization Mask Layout
W
HM-6561/883
WORST CASE CURRENT DENSITY:
1.337 x 105 A/cm2
LEAD TEMPERATURE (10s soldering):
≤ 300oC
HM-6561/883
S1
DQ3 DQ2
DQ1
DQ0
S2
A4
VCC
A3
A2
E
A1
GND
A0
A5 A6
A7
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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