HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : MOS200803
Issued Date : 2005.03.13
Revised Date :2010,03,04
Page No. : 4/5
A
L
3
BS
1
2
V
G
C
D
H
K
J
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Gate 2.Source 3.Drain
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
2.80 3.04
B
1.20 1.60
C
0.89 1.30
D
0.30 0.50
G
1.70 2.30
H 0.013 0.10
J
0.085 0.177
K
0.32 0.67
L
0.85 1.15
S
2.10 2.75
V
0.25 0.65
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office
• Head Office (Hi-Sincerity Microelectronics Corp.): 5/F., Golden Harvest Building 15 Wang Chiu Road, Kowloon Bay, Hong Kong
Tel: +852-2755-7162 Fax: +852-2755- 7795
AVANTICS : Shanghai Address: No.399, Cai Lum Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai 201210, China
Tel: +86(21) 61637118 Fax: +86(21)61637006
H2N7002K
HSMC Product Specification