MC10H016PG(2016) データシートの表示（PDF） - ON Semiconductor
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MC10H016PG Datasheet PDF : 5 Pages
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MC10H016
Table 2. MAXIMUM RATINGS
Symbol
Characteristic
VEE Power Supply (VCC = 0)
VI
Input Voltage (VCC = 0)
Iout Output Current
Continuous
Surge
TA
Operating Temperature Range
Tstg Storage Temperature Range
Plastic
Ceramic
Rating
Unit
−8.0 to 0
Vdc
0 to VEE
Vdc
mA
50
100
0 to +75
°C
°C
−55 to +150
−55 to +165
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°
25°
75°
Symbol
Characteristic
Min
Max
Min
Max
Min
Max
Unit
IE
Power Supply Current
IinH
Input Current High
All Except MR
Pin 12 MR
−
126
−
115
−
−
450
−
265
−
−
1190
−
700
−
126
mA
mA
265
700
IinL
Input Current Low
VOH
High Output Voltage
VOL
Low Output Voltage
VIH
High Input Voltage
VIL
Low Input Voltage
0.5
−
0.5
−
0.3
−
mA
−1.02
−0.84
−0.98
−0.81
−0.92
−0.735
Vdc
−1.95
−1.63
−1.95
−1.63
−1.95
−1.60
Vdc
−1.17
−0.84
−1.13
−0.81
−1.07
−0.735
Vdc
−1.95
−1.48
−1.95
−1.48
−1.95
−1.45
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 4. AC CHARACTERISTICS
0°
25°
75°
Symbol
Characteristic
Min
Max
Min
Max
Min
Max
Unit
tpd
Propagation Delay
Clock to Q
Clock to TC
MR to Q
ns
1.0
2.4
1.0
2.5
1.0
2.7
0.7
2.4
0.7
2.5
0.7
2.6
0.7
2.4
0.7
2.5
0.7
2.6
tset
Set-up Time
Pn to Clock
CE or PE to Clock
ns
2.0
−
2.0
−
2.0
−
2.5
−
2.5
−
2.5
−
thold
Hold Time
Clock to Pn
Clock to CE or PE
ns
1.0
−
1.0
−
1.0
−
0.5
−
0.5
−
0.5
−
fcount
tr
tf
Counting Frequency
Rise Time
Fall Time
200
−
200
−
200
0.5
2.0
0.5
2.1
0.5
0.5
2.0
0.5
2.1
0.5
−
MHz
2.2
ns
2.2
ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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