EMC1204(2006) データシートの表示（PDF） - SMSC -> Microchip

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EMC1204
(Rev.:2006)

Triple/Quad Single-Wire Temp Sensor in MSOP-8 Using SMSC BudgetBus™ Sensor Interface

SMSC -> Microchip 

Triple/Quad Single-Wire Temp Sensor in MSOP-8 Using SMSC BudgetBusTM Sensor Interface

Chapter 4 Package Outline

Datasheet

Figure 4.1 8-Pin MSOP Package Outline - 3x3mm Body 0.65mm Pitch

Table 4.1 8-Pin MSOP Package Parameters

MIN

NOMINAL

MAX

REMARKS

A

0.80

~

1.10

A1

0.05

~

0.15

A2

0.75

0.85

0.95

D

2.80

3.00

3.20

E

4.65

4.90

5.15

E1

2.80

~

3.20

H

0.08

~

0.23

L

0.40

~

0.80

L1

0.95 REF

e

0.65 BSC

θ

0o

~

8o

W

0.22

~

0.38

ccc

~

~

0.10

Overall Package Height

Standoff

Body Thickness

X Body Size

Y Span

Y body Size

Lead Foot Thickness

Lead Foot Length

Lead Length

Lead Pitch

Lead Foot Angle

Lead Width

Coplanarity

Notes:

1. Controlling Unit: millimeters.

2. Tolerance on the true position of the leads is ± 0.065 mm maximum.

3. Package body dimensions D and E1 do not include mold protrusion or flash. Dimensions D and

E1 to be determined at datum plane H. Maximum mold protrusion or flash is 0.15mm (0.006 inches)

per end, and 0.15mm (0.006 inches) per side.

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

Revision 1.1 (06-12-06)

8

DATASHEET

SMSC EMC1203/EMC1204

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