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AP105-DF57-2830S データシートの表示(PDF) - HIROSE ELECTRIC

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AP105-DF57-2830S Datasheet PDF : 8 Pages
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The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
DF57 SeriesSubstrate Twin (Pair) Cable Swing-Lock Connector for Low-Profile Power Source
Usage Recommendations
1.Recommended temperature profile
10secMAX
MAX 250ç
250
220ç�
200
180ç
150
100
0
90~120sec
60secMAX
TIME (sec)
PRE-HEATING TIME SOLDERING TIME
The temperature profiles are based on the above conditions.
In individual applications the actual temperature may vary,depending on solder paste type,
volume/thickness and board size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
2.Recommended manual soldering
3.Recommended screen thickness and open
area ratio (Pattern area ratio)
4.Board warpage
Manual soldering: 350ç ± 10ç for 3 seconds
Thickness: 0.1 mm
Open area ratio: 100%
Maximum of 0.02mm at the connector center, with both ends of the connector as reference points.
5.Cleaning conditions
6.Precautions
Cleaning is not recommended. When cleaning, please evaluate as if can deteriorate the 
performance including mechanical operation and environmental resistance.
nWhen inserting crimp-type (solderless) terminals to crimping (solderless) sockets, to maintain
reliable performance, please do not insert obliquely.
nDO NOT mate/un-mate non-terminated plugs with non-mounted receptacles.
This may lead to damage or deformation of the contacts.
nRemoval of the holding electric cable may cause damage so please be careful.
nDO NOT apply flux to the contact terminals when hand soldering the receptacle to the board.
Wicking of the flux into the electrical contact areas may lead to connection failures.
nSlight discoloration on the insulating materials will not affect form, fit or function of the
connectors.
nFor operating suggestions on insertion and removal, please refer separately to the "DF57
Insertion and Removal Manual".
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