DF12(3.0)-20DS-0.5V データシートの表示（PDF） - HIROSE ELECTRIC

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DF12(3.0)-20DS-0.5V

0.5mm Pitch SMT Board to Board Connector

HIROSE ELECTRIC 

BPrecautions for Use

1.Recommended Temperature Profile (SMT)

Note 1 : Maximum twice action is allowed under the same condition. However, the interval

between the first and second actions must be maintained at the room temperature.

Note 2 : The temperature indicates the board surface temperature In the connector lead area.

2.Recommended Manual Soldering Condition (SMT) Soldering iron temperature: 290±10ç, Soldering time: Within 2 seconds

3.Recommended Screen Thickness (SMT) 0.12mm

When the 0.15mm thickness is used, set the metal mask open area to 85% as a target.

4.Board Warp(SMT)

Maxmum 0.02mm in the connector center area, based on both connector edges

5.Cleaning Condition

Refer to "Nylon Connector Use Hand book".

6.Cautions

s The receptacle is designed in a structure where contacts are exposed. Touching it with

bare hands would cause contact failure or electrostatic element damage.

s Where no board is mounted, the insertion or extraction will cause damage or

contact deformation.

s Avoid retaining the board with the connector only, and fix the board by any other means

than the connector.

s Excessive scoop insertion or extraction may result in damage.

s In the manual soldering process, don't carry out the flux coating which will cause a flux

blister on the connector.

s The color phase of this product may be slightly different from that of the formed product

according to the manufacturing lot. However, the difference doesn't affect the performance.

A307

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