CMS14 データシートの表示（PDF） - Toshiba

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CMS14

Schottky Barrier Diode

Toshiba 

Schottky Barrier Diode

CMS14

○ Radio-Frequency Rectification in Switching Regulators

○ DC-DC Converters

CMS14

Unit: mm

• Repetitive peak reverse voltage : VRRM = 60 V

• Average forward current

: IF (AV) = 2.0 A

• Peak forward voltage

: VFM = 0.58 V (max)

• Suitable for high-density board assembly due to the use of a small

Toshiba Nickname: M−FLATTM

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Repetitive peak reverse voltage

Average forward current

Non-repetitive peak forward surge current

Junction temperature

Storage temperature range

Symbol

VRRM

IF (AV)

IFSM

Tj

Tstg

Rating

Unit

60

V

2.0 (Note 1)

A

40 (50 Hz)

A

−40 to 150

°C

−40 to 150

°C

JEDEC

1 ANODE

2 CATHODE

―

Note 1: Tℓ = 112°C

Device mounted on a ceramic board

board size

: 50 mm × 50 mm

Soldering land size : 2 mm × 2 mm

board thickness

: 0.64 mm

Rectangular waveform : α = 180°, VR = 30 V

JEITA

―

TOSHIBA

3-4E1S

Weight: 0.023 g (typ.)

Note2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Peak forward voltage

Repetitive peak reverse current

Junction capacitance

Thermal resistance

(junction to ambient)

Thermal resistance (junction to lead)

Symbol

Test Condition

Min

VFM (1) IFM = 1 A (pulse test)

―

VFM (2) IFM = 2 A (pulse test)

―

IRRM (1) VRRM = 5 V (pulse test)

―

IRRM (2) VRRM = 60 V (pulse test)

―

Cj

VR = 10 V, f = 1 MHz

―

Device mounted on a ceramic board

board size

50 mm × 50 mm

soldering land size 2 mm × 2 mm

―

board thickness

0.64 mm

Device mounted on a glass-epoxy board

Rth (j-a)

board size

50 mm × 50 mm

soldering land size 6 mm × 6 mm

―

board thickness

1.6 mm

Device mounted on a glass-epoxy board

board size

50 mm × 50 mm

soldering land size 2.1 mm × 1.4 mm

―

board thickness

1.6 mm

Rth (j-ℓ)

―

―

Typ.

0.45

0.53

0.6

25

77

―

―

―

―

Max Unit

―

V

0.58

―

μA

200

―

pF

60

135 °C/W

210

16 °C/W

Start of commercial production

2002-12

1

2018-10-16

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