20-30GHz Low Noise Amplifier
Typical Chip Assembly
CHA2190
- * Nominal Input and Output bonding lenght: 0.3 to 0.38nH for one 25µm bond wire.
- Chip backside is DC and RF grounded
Chip Biasing options
Ref :DSCHA21902036 -05-Feb.-02
7/8
Specifications subject to change without notice
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