CD4049 データシートの表示（PDF） - Intersil
部品番号
コンポーネント説明
一致するリスト
CD4049 Datasheet PDF : 11 Pages
| |||
CD4049UBMS
Typical Performance Characteristics (Continued)
105
86
AMBIENT TEMPERATURE (TA)
= +25oC
4
2
104
86
4
SUPPLY VOLTAGE
(VDD) = 15V
103 2
86
4
2
10V
10V
5V
102 86
4
LOAD CAPACITANCE (CL) = 50pF
(11pF FIXTURE + 39pF EXT)
2
CL = 15pF (11pF FIXTURE + 4pF EXT
10
2 4 68 2
10
102
4 68 2
103
4 68 2
104
4 68
105
INPUT FREQUENCY (f) (kHz)
FIGURE 8. TYPICAL POWER DISSIPATION vs FREQUENCY
CHARACTERISTICS
Chip Dimensions and Pad Layout
106 AMBIENT TEMPERATURE (TA) = +25oC
105
15V; 1MHz
104
15V; 100KHz
103
10V; 100KHz
15V; 10KHz
102
10V; 10KHz
10
15V; 1KHz
SUPPLY VOLTAGE (VCC) = 5V
FREQUENCY (f) = 10KHz
1
10 102 103 104 105 106 107 108
INPUT RISE AND FALL TIME (tr, tf) (ns)
FIGURE 9. TYPICAL POWER DISSIPATION vs INPUT RISE
AND FALL TIMES PER INVERTER
Dimensions in parenthesis are in millimeters and are derived
from the basic inch dimensions as indicated. Grid graduations
are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
FN3315 Rev 1.00
March 6, 2007
Page 9 of 11
Share Link: 