BS616UV4016DCP10 データシートの表示（PDF） - Brilliance Semiconductor

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BS616UV4016DCP10

Ultra Low Power/High Speed CMOS SRAM 256K X 16 Bit

Brilliance Semiconductor 

BSI

n ORDERING INFORMATION

BS616UV4016 X X Z Y Y

BS616UV4016

SPEED

85: 85ns

10: 100ns

PKG MATERIAL

-: Normal

G: Green

P: Pb free

GRADE

C : +0oC ~ +70oC

I : -40oC ~ +85oC

PACKAGE

D: DICE

E: TSOP 2-44

A: BGA-48-0608

Note:

BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not

authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in

significant injury or death, including life-support systems and critical medical instruments.

n PACKAGE DIMENSIONS

NOTES

:

1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.

3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.

BALL PITCH e = 0.75

D

E

N

D1

E1

8.0

6.0

48

5.25

3.75

D1

VIEW A

48 mini-BGA (6 x 8mm)

R0201-BS616UV4016

9

Revision 1.3

Sep. 2005

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