BD2202G データシートの表示（PDF） - ROHM Semiconductor
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BD2202G Datasheet PDF : 26 Pages
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BD2202G BD2206G
Datasheet
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity
when connecting the power supply, such as mounting an external diode between the power supply and the IC’s
power supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of
the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the
analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is
when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute
maximum rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the
IC has more than one power supply. Therefore, give special consideration to power coupling
capacitance, power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supply should always be turned off completely before connecting or removing it from the test setup during the
inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may
result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and
output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid
environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ02201-0E3E0H300180-1-2
21.Aug.2014 Rev.003
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